IDC's Semiconductors: Networking, Broadband, and Storage Systems service offers market sizing and vendor share analysis for key chip segments within the networking (LAN, MAN, and WAN), broadband access and storage system markets. IDC focuses on providing tactical and strategic perspectives to improve a company's visibility in these dynamic areas. The service is a key resource to help guide clients through the upcoming transitions in technologies and clarify opportunities within these areas of the semiconductor industry.

This service covers the following segments of the networking and storage systems semiconductor market:

• Ethernet LAN and WAN switch infrastructure and network interface card (NIC)/LAN on Motherboard (LOM) ICs
• SONET/SDH, T/E, and ATM ICs within access, edge, and core datacom and telecom infrastructure
• Communication processors, network processors, co-processors, and switch fabrics
• Fibre Channel (FC) SANs, iSCSI SANs, Fiber Channel over Ethernet (FCoE), RAID controllers, HBAs
• xDSL central office (CO)/CPE
• Cable modem CPE
• Passive Optical Networking (PON) OLT and ONT/ONU
• Voice over IP (VoIP) IP phones, PBXs, media gateways

Throughout the year, this service will address the following topics:

• Vendor market share for key application-specific chip segments
• Impact of integration within networking physical and logical layer segments
• Technology trends and transitions
• Competitive analysis of semiconductor vendors and their leading OEM/ODM customers

1. Which network equipment markets offer the greatest potential for sales growth?
2. What is the outlook for 10 Gigabit Ethernet (GE) and what applications will drive it? Which startups and established vendors will lead the way?
3. How will the functions of communication processors, network processors, and coprocessors merge over time?
4. How will trends toward integration and higher data rates affect broadband chipset replacement cycles?
5. How will the convergence of voice and data networks impact VoIP semiconductor providers?
6. What is the outlook for PON/FTTx gear, and how will the components enable voice, data, and video services?
7. How will the role of iSCSI SANs change SMB and enterprise storage deployment in the future?
8. How will 10GE iSCSI and FCoE affect deployment of FC-based SANs?

IDC's Semiconductors: Networking, Broadband, and Storage Systems service examines how chip vendors are positioning themselves to compete in the networking, broadband access, and storage system markets. This service analyzes the product strategies, competitive positioning, and future direction of major semiconductor vendors and emerging startups, including:

AMCC, Aquantia, ARM, Atmel, Avago, Broadcom, Cavium, Centillium, Conexant, Cortina, Emulex, Exar, EZChip, Freescale, Fujitsu, Fulcrum Microsystems, Hifn, IBM, IDT, Ikanos, Infineon, Intel, LSI, Marvell, Microtune, Mindspeed, MIPS, NEC, Neterion, NetLogic, Octasic, PMC-Sierra, Realtek, Renesas, RF Micro Devices, Solarflare, Sun, Teranetics, Texas Instruments, TranSwitch, Vitesse, and Xelerated.

Throughout the year, this service focuses on the following core research:

This study examines Ethernet ASIC/ASSP components in switch, NIC, and LOM markets. Segments are broken down by various speeds and system markets.

This study examines Ethernet semiconductor vendors selling application-specific chips into LAN and WAN switching infrastructure and NIC/LOM connectivity designs. Market shares in the Fast Ethernet, GE, and 10 GE segments are also covered.

This study examines the semiconductor markets for ADSL, SDSL, and VDSL (CO and CPE) systems and cable modems. Coverage includes transceiver ASICs/ASSPs and communications processors consumed by these systems.

This study examines DSL and cable modem semiconductor suppliers. For DSL, comm processors, single-port/multiport PHY, analog front end, and line driver/receiver ICs are covered; for cable modems, integrated cable modem and tuner ICs are covered.

This study examines all application-specific wired semiconductors (including ASSPs and ASICs) for the datacom/telecom equipment markets. It includes market rankings for T/E, ATM, SONET/SDH, communication processing and network processing chip suppliers.

This study examines the semiconductor markets for T/E, ATM, and SONET/SDH ASIC/ASSP components, as well as for communication and network processors. Wired physical layer and logical layer products in the data networking, access, optical, voice, and mobile infrastructure markets are included.

This study looks at the market for semiconductors going into storage system infrastructure. This market includes primarily components shipping into RAID controllers within servers and disk arrays, along with FC and emerging iSCSI SAN infrastructure.

This study examines voice processing-specific semiconductors within VoIP end markets. A top-line forecast segmented by key end market is provided.

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